Circuit Models

An extensive set of passive and active linear and nonlinear models works with each of the circuit simulators.

Semiconductor Device Models

Nonlinear Models

• MESFET/HEMT Models
• TOM3
• Agilent EEFET3 and EEHEMT1
• Agilent Root MESFET/HEMT (HPFET)
• Angelov
• TOM scaleable
• Curtice quadratic and cubic
• Advanced Curtice
• Statz, et al. (Raytheon)
• Materka
• Modified Materka (Rizzoli)
• Tajima
• JFET

• BJT Models
• HICUM v 2.22
• HICUM/L0 (v. 1.11)
• NXP MEXTRAM 504.6.2, 503
• NXP BJT 500, BJT 3500
• VBIC version 1.1.4 (with external thermal node)
• Agilent HBT
• Gummel-Poon
• ST BJT
• Agilent EEBJT2

• MOSFET Models
• PSP (v. 102.1)
• BSIM 4 (v 4.5)
• BSIM 3 (v 3.3)
• BSIMSOI (v 4.0)
• NXP MOS Model 11 -- Level 1101(0/1)
• NXP MOS Model 20
• NXP MOS Model 31
• NXP MOS Model 40
• NXP MOS Model 9
• Agilent Root MOSFET
• Agilent EEMOS1
• BSIM1
• BSIM2
• MOS level 1,2,3, 3NMOD

• Diode Models
• PN diodes
• NXP JUNCAP 200
• Agilent Root
• SRD
• DIO500

Linear Models

• Hybrid Pi and T-equivalent bipolar transistor
• Bipolar transistor models with alpha and beta current gains
• FET models with and without source resistance
• FET noise models
• Dual-gate FET
• PIN diodes

Passive Element Models

• General lumped element models, including resistors, ideal and non-ideal capacitors, inductors and transformers, ideal and non-ideal transmission line elements
• Microstrip elements
• Single and multiple coupled lines models
• Junction and discontinuity models (corners, bends, curves, crosses, tees, vias, taper)
• Spiral inductors, interdigital capacitor and Lange coupler models
• Thin-film capacitors and resistors models
• Multi-layer elements
• Printed circuit board lines models
• Single and multiple coupled lines
• Junction and discontinuity models (corners, bends, curves, cross, tees, vias, taper)
• Coupled radial, slanted and crossover line models
• Stripline elements
• Single and multiple coupled lines models
• Junction and discontinuity models (corners, bends, crosses, tees)
• Suspended stripline elements
• Single and multiple coupled lines
• Finline elements
• Single lines and terminations
• Coplanar waveguide elements
• Single and multiple coupled lines
• Passive RF circuit elements including bondwire models and multiple coupled inductors
• Bandstop, bandpass, highpass and lowpass filters (Butterworth, Chebyshev, Elliptic, Bessel-Thompson, Gaussian, GMSK, Raised Cosine, Pole_Zero, Polynomial)

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