RF System-in-Package/Module - Value Propositions

Agilent EEsof EDA is the industry leader in high frequency simulation technologies. The seamless integrated design environment offers RF SiP/Module designers full access to system, circuit, and electromagnetic simulations that enable co-design of system, circuit, package, and interconnects together to achieve the highest productivity in RF-SIP/Module design by eliminating multiple stops and starts associated with changing design tools in mid-cycle.

Since Agilent Technologies engineers design RF SiP/Modules as their customers do, they better understand, not only the design challenges, but also how to design the right solution. The RF SiP/Module solutions are also proven by Agilent RF SiP/Module designers in the state-of-the-art instrumentation and RF SiP/Module components.

Agilent EEsof EDA delivers the industries best design solution for RF SiP/Module by:

• Achieving First Pass Design Success
• Reducing Risk of Last Minute Design Failures
• Providing a Proven Methodology for High Accuracy Designs

Agilent EEsof EDA provides the fastest way to first pass design success with co-design simulation flow for over 4x cycle time reduction.

RF SiP/Modules are typically complex systems or sub-systems with multiple ICs, off-chip passives, and various interconnects in a single package. The co-design with multiple technologies to analyze the complex and dynamic interactions between them is the key to fist pass design success. The comprehensive RF SiP/Module Design Solutions from Agilent EEsof are designed to specifically address these complex design problems by enabling circuit, system and EM co-simulation and co-optimization in a single integrated design environment, which eliminates the need for design translation and data manipulation. Consequently, the Agilent EEsof’s RF-SIP co-design flow allows RF SiP/Module designers to complete the design efficiently where at least 4x of RF-SIP design cycle improvement is easily achieved.

RF MCM Co-design Example

Agilent EEsof EDA provides the best way to reduce risks of last minute design failures with most complete and integrated modeling solutions.

The most painful experience of the RF SiP/Module designer is to see a good design ruined at the last minute due to the unaccounted physical effects of the package, interconnect, and transition which cannot be assumed or treated as simple short circuits at increasing bandwidth and speed requirements.

Off-chip and embedded passive components also start introducing significant parasitics and coupling problems at high frequencies.

Agilent EEsof has specifically integrated the complete range of 3D electromagnetic simulation technologies into the RF SiP/Module design flow to tackle these challenges. It provides the fullest modeling and verification of physical effects on RF SiP/Module performance before committing to production.

Agilent EEsof provides world-class EM simulation technologies ranging from Method of Moments (MoM), Finite Element Method (FEM), and Finite Difference Time Domain (FDTD). By integrating EM simulation results of passives, packages, interconnects, and transitions to system and circuit design, it is now possible to co-simulate and co-optimize all aspects of the RF SiP/Module for optimal production yield and performance.

Since the accuracy of simulations is only as good as the device models, Agilent EEsof EDA also offers the Integrated Circuit Characterization and Analysis Program (IC-CAP) for efficient and accurate extraction of active device and circuit model parameters. IC-CAP provides powerful characterization and analysis capabilities for all of today's semiconductor modeling processes.

Agilent EEsof EDA provides a proven methodology to design RF SiP/Module with the highest accuracy and confidence.

Since pioneering high frequency simulation technologies more than 25 years ago, Agilent EEsof EDA leads the high frequency electronic design automation (EDA) industry with continuing development of proven, robust, and accurate simulation technologies. The proven and complete set of simulation technologies ranging from frequency-domain, time-domain, data flow to electromagnetic simulation which are complimented with rich sets of accurate active and passive models deliver the simulation accuracy that RF SiP/Module designers need to confidently achieve more one-pass design wins at lower development costs than competitors.

Agilent EEsof’s continuous, industry-leading technology innovations in power, speed, and convergence give RF SiP/Module designers the tools master real world design challenges.